Food In Canada

Nanotechnology: small in size, big in possibilities

By Dr. Ron Wasik   

Food Safety Packaging Research & Development R&D science

Packaging – Scientists are applying NT/ENM to packaging in three ways:

• Static applications: Nano-sized metals such as magnesium, silver and zinc as well as silica and clay incorporated into nano-composites, can improve the mechanical and barrier properties of plastic food packaging materials, which can enhance packaging integrity and extend shelf life.

• Active packaging: In addition to improving strength and barrier properties of packing materials, metallic nano particles have been shown to inhibit the growth of spoilage and pathogenic bacteria. Hence, incorporating titanium, silver, magnesium or zinc in food-contact packaging materials can improve food safety and shelf life.

• Smart packaging: Nano-sized biosensors are being engineered into food contact materials to monitor the shelf life of the product and to detect pathogens. Biosensors are also being developed for traceability. In essence, these are nano-radio frequency identification devices (RFID) that can be applied at the same time the package is printed.

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Due to the fact that there is so little information on the toxicology and environmental implications of ENMs, most regulatory agencies in the developed world are carefully scrutinizing each application, especially for active and smart packaging. Health Canada requires any company using or exploring the use of ENMs to notify them. Because biological NMs have been part of our existence throughout our evolution, I think that there is little need to be concerned about them. However, non-biological ENMs in food-contact materials concern me because there appears to be little toxicological data in support of this application at this time.

Dr. Ron Wasik, PhD, MBA, is president of RJW Consulting Canada Ltd. Contact him at rwasik@rjwconsultingcanada.com

I wish to thank Dr. Berna Magnuson of Cantox Health Sciences International for providing me with information on this subject. – R.W.


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